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    Solar wafer AOI and high-speed sorting equipment

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    Parameters

    Dimension

    10680*1600*2150mm

    Weight

    4630kg

    Rated power

    20kw

    Electric power

    AC380v/50hz

    Air pressure

    0.5~0.6mpa

    Functions and Performance

    Type

    Solar monocrystalline /polysilicon wafers cut by diamond thread

    Dimension

    157*157~230*230mm

    Thickness

    80-240um

    Defects

    Warping, bending, edge chipping,
    surface chipping, chamfer chipping,
    soiling, holes, hidden cracks

    Measurement item

    Thickness, Wire Marks, Resistivity, TTV,
    Roughness, Dimensions, PN Type

    CT(182*182mm)= 0.25s/pcs,WPH≥16000

    CT(210*210mm)= 0.3 s/pcs,WPH≥14000

    Workflow

    • Dimension/fragmentation inspection
      �
    • Hidden crack inspection
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    • Left and right chipping inspection
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    • Chamfering and chipping inspection
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    • Upper dirt inspection
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    • Sorting and discharging
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    • Front and rear chipping inspection
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    • PN type/resistivity test
      �
    • Thickness / wire mark / roughness inspection
      �
    • Lower dirt inspection
      �
    • Sorting and discharging
      �
    • Dimension/fragmentation inspection
      �
    • Front and rear chipping inspection
      �
    • Hidden crack inspection
      �
    • PN type/resistivity test
      �
    • Left and right chipping inspection
      �
    • Thickness / wire mark / roughness inspection
      �
    • Chamfering and chipping inspection
      �
    • Lower dirt inspection
      �
    • Upper dirt inspection
      �

    Advantages

    • � Function and Performance Advantages

      Currently the industry's highest performance in terms of wafers per hour (WPH) is more than 16,000, which is much higher than the industry average of 10,000~12,000. Measurement accuracy reaches 0.8um, fragmentation rate is stable below 0.05%. Leakage rate < 0.1%. Overkill rate < 0.05%.

    • &#0; Electromechanical Advantages

      Feeding: two sets of cache mechanism seamlessly connects the feeding; compatible with multi-size flower baskets;Unloading: Bernoulli suspension type unloading device is adopted to ensure a very low fragmentation rate; parallel multiple independent unloading devices; seamless switching of unloading boxes.

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    • &#0; Inspection Advantages

      Multi-station inspection of chipping and surface defects around the wafer, using a deep learning model that recognises the silicon material and completes the inspection with high accuracy.

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    • &#0; Measurement Advantages

      Dual top and bottom line scanning cameras accurately identify thickness, flatness and line marks. Rejecting hidden cracks and fragments in advance of the inspection stage reduces the burden of subsequent downstream sorting.

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